David K. Lam

Designs, manufactures, markets, refurbishes and services wafer-fabrication equipment for semiconductor industry

DynaFund Ventures focuses on investments in US-based technology companies. They invest primarily in the communications and networking, electronics and photonics, infrastructure software and process technology sectors. Within the communications and networking sectors, the firm focuses on (1) wireless voice/data systems, components and software (2) local area network, metropolitan area network and wide area network systems and components and (3) storage systems, components and software. DynaFund Ventures' investments in the electronics and photonics sector focus on (1) application specific advanced electronic, micro-electromechanical systems (MEMS), nanotechnology and photonic components (2) advanced integrated circuits, modules and design tools (3) computer components, modules, subsystems and systems (4) component manufacturing and device fabrication, tools, equipment and systems and (5) novel applications of materials, components, modules and electronic systems. Within the infrastructure software industry, DynaFund Ventures invests primarily in (1) Intranet and extranet applications, tools and services (2) enterprise software applications (3) caching, streaming and other Internet traffic management applications and (4) electronic design automation. The firm's investments in the areas of process technology focus on (1) semiconductor fabrication tools and equipment (2) MEMS and nanotechnology related tools and (3) test/verification tools and technologies. DynaFund Ventures looks for companies that are developing innovative approaches and disruptive technology that will lead to dramatic changes in design, materials and fabrication technologies. They also look for companies that are developing and applying new technologies to increase the manageability, flexibility and capacity of communications networks. DynaFund Ventures invests in companies that use the Internet as a technological and strategic tool to provide business efficiencies and allow more rapid growth than was previously possible. They also invest in companies offering software and systems that allow businesses to streamline the way they manage and exchange data. In addition, the firm looks for companies that are developing new approaches to the convergence of data, voice and video and to network access. DynaFund Ventures typically invests in the range of $1 million to $5 million in each financing round. They usually serve as the lead or co-lead investor. The firm also participates in the subsequent funding rounds of their portfolio companies. DynaFund Ventures can syndicate larger amounts of capital through their relationships with other venture capital firms and investors.

Provides wafer inspection solutions

Provides silicon validation and failure analysis tools

Develops and provides internal surface coating and enhancement services

Designs x-ray imaging systems

Designs, manufactures, and markets fiber-optic components and modules

Functions as a College/University

Functions as a College/University