Chia Fred

Mutual-Pak Technology Co., Ltd. provides RFID design and manufactures wafer level RFID CSP, Strap, Inlay, and varied Tags. Its core technology includes Wafer Level Packaging P-CSP, P-CSP™ R/W test system and SMD for RFID assembly. The company was founded on March 26, 2006 and is headquartered in Taoyuan, Taiwan.

Mutual-Pak Technology Co., Ltd. provides RFID design and manufactures wafer level RFID CSP, Strap, Inlay, and varied Tags. Its core technology includes Wafer Level Packaging P-CSP, P-CSP™ R/W test system and SMD for RFID assembly. The company was founded on March 26, 2006 and is headquartered in Taoyuan, Taiwan.

Mutual-Pak Technology Co., Ltd. provides RFID design and manufactures wafer level RFID CSP, Strap, Inlay, and varied Tags. Its core technology includes Wafer Level Packaging P-CSP, P-CSP™ R/W test system and SMD for RFID assembly. The company was founded on March 26, 2006 and is headquartered in Taoyuan, Taiwan.

Mutual-Pak Technology Co., Ltd. provides RFID design and manufactures wafer level RFID CSP, Strap, Inlay, and varied Tags. Its core technology includes Wafer Level Packaging P-CSP, P-CSP™ R/W test system and SMD for RFID assembly. The company was founded on March 26, 2006 and is headquartered in Taoyuan, Taiwan.