![Feng Gao](https://cdn.zonebourse.com/static/resize/768/576//static/images/insiders/unknown.png)
Feng Gao
Director/Miembro de la Junta en Shenzhen SEICHI Technologies Co., Ltd. .
Perfil
Feng Gao currently works at Shenzhen SEICHI Technologies Co., Ltd., as Director from 2021 and HENGHUI Technology Corp.
Ltd., as Independent Director from 2020.
Mr. Gao received his graduate degree from Chinese Academy of Sciences.
Cargos activos de Feng Gao
Empresas | Cargo | Inicio |
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Shenzhen SEICHI Technologies Co., Ltd.
![]() Shenzhen SEICHI Technologies Co., Ltd. Electronic Equipment/InstrumentsElectronic Technology Shenzhen SEICHI Technologies Co., Ltd. engages in the provision of testing equipment and system solutions. Its products include detection of new display devices and semiconductor memory device testing. The detection of new display devices include optical inspection and correction repair system, aging system, touch detection system, and signal generator. The semiconductor memory device testing involves memory wafer test system, memory aging repair system and memory packaging test system. The company was founded on May 31, 2011 and is headquartered in Shenzhen, China. | Director/Miembro de la Junta | 03/01/2021 |
Henghui Technology Corp. Ltd.
![]() Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Director/Miembro de la Junta | 01/11/2020 |
Formación de Feng Gao.
Chinese Academy of Sciences | Graduate Degree |
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Empresas relacionadas
Empresas cotizadas | 1 |
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![]() | Electronic Technology |
Empresas privadas | 1 |
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Henghui Technology Corp. Ltd.
![]() Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Producer Manufacturing |
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