Houck S. Reed

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Electronic Technology

Consumer Services

Technology Services

Perfil

Houck S.
Reed worked as a Director of Product Management at Gen Digital Inc. He was a Vice President of BNS Product Management at Tekelec Global, Inc. from 2007 to 2011.
He also worked as a Manager of International Switching Product Management at UTStarcom Holdings Corp.
and as a Product Manager of Intelligent Network Unit at Nokia of America Corp.
Mr. Reed received his undergraduate degree from The University of Chicago and his MBA from Yale School of Management.

Antiguos cargos conocidos de Houck S. Reed.

Empresas	Cargo	Fin
Nokia of America Corp. Nokia of America Corp. Wireless TelecommunicationsCommunications Nokia of America Corp. develops and provides networking and communications technology, products and services. It offers fixed and mobile broadband, IP and optical technologies. The firm offers a portfolio of solutions and services for telecom services providers, public and private organizations, wireline and wireless operators and enterprises. The company is headquartered in Murray Hill, NJ.	Corporate Officer/Principal	-
GEN DIGITAL INC.	Corporate Officer/Principal	-
UTSTARCOM HOLDINGS CORP.	Corporate Officer/Principal	-
Tekelec Global, Inc. Tekelec Global, Inc. Computer CommunicationsElectronic Technology Tekelec Global, Inc. provides mobile broadband solutions. The company was founded by Jean-Claude Asscher in December 1971 and was headquartered in Morrisville, NC.	Corporate Officer/Principal	-

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Formación de Houck S. Reed.

The University of Chicago	Undergraduate Degree
Yale School of Management	Masters Business Admin

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