Jay B. Grover
No más puestos en curso
Historial de carrera de Jay B. Grover
Antiguos cargos conocidos de Jay B. Grover.
| Empresas | Cargo | Inicio | Fin |
|---|---|---|---|
| FTC SOLAR, INC. | Corporate Officer/Principal | 01/05/2019 | 27/08/2021 |
| SUNEDISON INC | Corporate Officer/Principal | 01/01/2010 | 01/01/2017 |
FlipChip International LLC
 FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | Director de Operaciones | 01/01/2005 | 01/01/2010 |
AGC Multi Material America, Inc.
 AGC Multi Material America, Inc. Electronic ComponentsElectronic Technology Part of AGC, Inc. (Japan), AGC Multi Material America, Inc. manufactures and markets printed circuit materials. The company is based in Tempe, AZ. | Presidente | 01/01/1997 | 01/01/2005 |
Estadísticas
Internacional
| Estados Unidos | 5 |
Operativa
| Corporate Officer/Principal | 2 |
| Chief Operating Officer | 1 |
| President | 1 |
Sectorial
| Electronic Technology | 3 |
| Technology Services | 2 |
| Utilities | 2 |
Funciones ocupadas
Activas
Inactivas
Empresas cotizadas
Empresas privadas
Empresas relacionadas
| Empresas cotizadas | 1 |
|---|---|
| FTC SOLAR, INC. | Technology Services |
| Empresas privadas | 3 |
|---|---|
SunEdison, Inc.
 SunEdison, Inc. Alternative Power GenerationUtilities SunEdison, Inc. engages in the provision of renewable-energy services. The company was founded on August 6, 1959 and is headquartered in Maryland Beltsville, MD. | Utilities |
FlipChip International LLC
FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ. | Electronic Technology |
AGC Multi Material America, Inc.
AGC Multi Material America, Inc. Electronic ComponentsElectronic Technology Part of AGC, Inc. (Japan), AGC Multi Material America, Inc. manufactures and markets printed circuit materials. The company is based in Tempe, AZ. | Electronic Technology |
- Bolsa de valores
- Insiders
- Jay B. Grover
- Experiencia
