Jin Aun Lew
Presidente en Selangor Human Resources Development Centre .
Fortuna: 514 568 $ al 31/05/2024
Cargos activos de Jin Aun Lew
| Empresas | Cargo | Inicio | Fin |
|---|---|---|---|
| Selangor Human Resources Development Centre | Presidente | - | - |
Historial de carrera de Jin Aun Lew
Antiguos cargos conocidos de Jin Aun Lew.
| Empresas | Cargo | Inicio | Fin |
|---|---|---|---|
| JF TECHNOLOGY | Director/Miembro de la Junta | 02/01/2009 | 01/12/2022 |
| Independent Dir/Board Member | 02/01/2009 | 01/12/2022 | |
| STATS CHIPPAC LTD. | Director Ejecutivo | - | - |
Motorola Solutions Malaysia Sdn. Bhd.
 Motorola Solutions Malaysia Sdn. Bhd. Telecommunications EquipmentElectronic Technology Part of Motorola Solutions, Inc., Motorola Solutions Malaysia Sdn. The company is based in Petaling Jaya, Malaysia. Bhd. is a Malaysian company that manufactures communication devices and equipment. | Director Ejecutivo | - | - |
Formación de Jin Aun Lew.
| University of Malaya | Undergraduate Degree |
| University of Bath | Masters Business Admin |
Estadísticas
Internacional
| Malasia | 5 |
| Singapur | 2 |
| Reino Unido | 2 |
Operativa
| Chief Executive Officer | 2 |
| Director/Board Member | 1 |
| Independent Dir/Board Member | 1 |
Sectorial
| Electronic Technology | 4 |
| Consumer Services | 3 |
Funciones ocupadas
Activas
Inactivas
Empresas cotizadas
Empresas privadas
Empresas relacionadas
| Empresas cotizadas | 1 |
|---|---|
| JF TECHNOLOGY | Electronic Technology |
| Empresas privadas | 3 |
|---|---|
| Selangor Human Resources Development Centre | |
Motorola Solutions Malaysia Sdn. Bhd.
Motorola Solutions Malaysia Sdn. Bhd. Telecommunications EquipmentElectronic Technology Part of Motorola Solutions, Inc., Motorola Solutions Malaysia Sdn. The company is based in Petaling Jaya, Malaysia. Bhd. is a Malaysian company that manufactures communication devices and equipment. | Electronic Technology |
STATS ChipPAC Pte Ltd.
 STATS ChipPAC Pte Ltd. Electronic Equipment/InstrumentsElectronic Technology STATS ChipPAC Pte Ltd. engages in the provision of semiconductor test and packaging services. Its services includes design, characterization, and wafer bumping.The company was founded by June Lihan Chia in 1994 and is headquartered in Singapore. | Electronic Technology |
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