Klaus Berka

Aifotec AG engages in the development and distribution of integrated circuit packaging, assembly, and bonding technology solutions for photonic and semi-conductor components. The firm’s products include laser-based spot size eutectic bonding, heat plate-based eutectic bonding, epoxy bonding, and fiber coupling technology. It also provides development, production, and partner services. The company was founded by Gunther Vollrath on November 27, 2000 and is headquartered in Jena, Germany.

Aifotec AG engages in the development and distribution of integrated circuit packaging, assembly, and bonding technology solutions for photonic and semi-conductor components. The firm’s products include laser-based spot size eutectic bonding, heat plate-based eutectic bonding, epoxy bonding, and fiber coupling technology. It also provides development, production, and partner services. The company was founded by Gunther Vollrath on November 27, 2000 and is headquartered in Jena, Germany.

Aifotec AG engages in the development and distribution of integrated circuit packaging, assembly, and bonding technology solutions for photonic and semi-conductor components. The firm’s products include laser-based spot size eutectic bonding, heat plate-based eutectic bonding, epoxy bonding, and fiber coupling technology. It also provides development, production, and partner services. The company was founded by Gunther Vollrath on November 27, 2000 and is headquartered in Jena, Germany.

Aifotec AG engages in the development and distribution of integrated circuit packaging, assembly, and bonding technology solutions for photonic and semi-conductor components. The firm’s products include laser-based spot size eutectic bonding, heat plate-based eutectic bonding, epoxy bonding, and fiber coupling technology. It also provides development, production, and partner services. The company was founded by Gunther Vollrath on November 27, 2000 and is headquartered in Jena, Germany.