Origen de la red de primer grado Marcus Crayon.
| Entidad | Tipo de entidad | Industria | |
|---|---|---|---|
FlipChip International LLC
 FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ.
4
| Subsidiary | Semiconductors | 4 |
Gráfico Empresas conectadas de segundo grado
Relaciones con varias empresas
Empresas conectadas a Marcus Crayon a través de su red personal
| Empresa | Sector | Personas relacionadas | Puesto principal |
|---|---|---|---|
| FTC SOLAR, INC. | Packaged Software | Corporate Officer/Principal | |
| SUNEDISON INC | Alternative Power Generation | Corporate Officer/Principal | |
AGC Multi Material America, Inc.
 AGC Multi Material America, Inc. Electronic ComponentsElectronic Technology Part of AGC, Inc. (Japan), AGC Multi Material America, Inc. manufactures and markets printed circuit materials. The company is based in Tempe, AZ. | Electronic Components | President |
Estadísticas
Internacional
| Estados Unidos | 4 |
Sectorial
| Technology Services | 2 |
| Utilities | 2 |
| Electronic Technology | 2 |
Operativa
| Sales & Marketing | 2 |
| President | 2 |
| Corporate Officer/Principal | 2 |
| Director of Finance/CFO | 1 |
| Chief Operating Officer | 1 |
Las relaciones más conectadas
| Insiders | |
|---|---|
| Jay B. Grover | 4 |
| Fred Hickman | 1 |
| David McComb | 1 |
| Greg Marshall | 1 |
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