![Bao Zeng Wang](https://cdn.zonebourse.com/static/resize/768/576//static/images/insiders/unknown.png)
Bao Zeng Wang
Director/Miembro de la Junta en Henghui Technology Corp. Ltd. .
Perfil
Bao Zeng Wang is currently a Member-Supervisory Board at HENGHUI Technology Corp.
Ltd.
His education history includes being a graduate from Southeast University.
Cargos activos de Bao Zeng Wang
Empresas | Cargo | Inicio |
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Henghui Technology Corp. Ltd.
![]() Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Director/Miembro de la Junta | 01/11/2020 |
Formación de Bao Zeng Wang.
Southeast University | Graduate Degree |
Experiencias
Funciones ocupadas
Activas
Inactivas
Empresas cotizadas
Empresas privadas
Relaciones
Relaciones de 1er grado
Empresas vinculadas al 1er grado
Hombre
Mujer
Administradores
Ejecutivos
Empresas relacionadas
Empresas privadas | 1 |
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Henghui Technology Corp. Ltd.
![]() Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Producer Manufacturing |
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