Bin Hu
Director Técnico/Científico/I+D en Lansus Technologies, Inc. .
Cargos activos de Bin Hu
| Empresas | Cargo | Inicio | Fin |
|---|---|---|---|
Lansus Technologies, Inc.
 Lansus Technologies, Inc. Telecommunications EquipmentElectronic Technology Lansus Technologies, Inc. engages in the research, development, design and sale of radio frequency (RF) front-end chips. It provides 5G modules, 4G power amplifiers (PAs) & modules, 2G-3G PAs & modules, RF switches and ubiquitous connectivity products. The company was founded by Hua Long on May 15, 2015 and is headquartered in Shenzhen, China. | Director Técnico/Científico/I+D | 01/08/2016 | - |
Historial de carrera de Bin Hu
Formación de Bin Hu.
| Xidian University | Graduate Degree |
Estadísticas
Internacional
| China | 3 |
Operativa
| Chief Tech/Sci/R&D Officer | 1 |
| Graduate Degree | 1 |
Sectorial
| Electronic Technology | 2 |
| Consumer Services | 2 |
Funciones ocupadas
Activas
Inactivas
Empresas cotizadas
Empresas privadas
Empresas relacionadas
| Empresas privadas | 1 |
|---|---|
Lansus Technologies, Inc.
Lansus Technologies, Inc. Telecommunications EquipmentElectronic Technology Lansus Technologies, Inc. engages in the research, development, design and sale of radio frequency (RF) front-end chips. It provides 5G modules, 4G power amplifiers (PAs) & modules, 2G-3G PAs & modules, RF switches and ubiquitous connectivity products. The company was founded by Hua Long on May 15, 2015 and is headquartered in Shenzhen, China. | Electronic Technology |
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