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Hansjörg Müller
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Historial de carrera de Hansjörg Müller
Antiguos cargos conocidos de Hansjörg Müller.
Empresas | Cargo | Inicio | Fin |
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Besi Switzerland AG
![]() Besi Switzerland AG Containers/PackagingProcess Industries Part of BE Semiconductor Industries NV, Besi Switzerland AG is a Swiss company that develops assembly processes and equipment for leadframe, substrate, and wafer level packaging applications in various markets, including electronics, mobile internet, cloud server, computing, automotive, industrial, LED, and solar energy. The company is based in Cham, Switzerland. Besi Switzerland offers a range of products and services, including die attach, die bonding, flip chip, packaging molding, trim and form, singulation, accessories, and services. The company also provides process technology, chemistry and tooling, after-sales spares and tooling, customer support, and career opportunities. | Corporate Officer/Principal | 01/01/1999 | 01/01/1999 |
SCHLATTER INDUSTRIES AG | Director Técnico/Científico/I+D | 01/04/2002 | - |
Formación de Hansjörg Müller.
University of Zurich | Graduate Degree |
Estadísticas
Internacional
Suiza | 4 |
Operativa
Corporate Officer/Principal | 1 |
Chief Tech/Sci/R&D Officer | 1 |
Graduate Degree | 1 |
Sectorial
Process Industries | 2 |
Producer Manufacturing | 2 |
Consumer Services | 2 |
Funciones ocupadas
Activas
Inactivas
Empresas cotizadas
Empresas privadas
Empresas relacionadas
Empresas cotizadas | 1 |
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SCHLATTER INDUSTRIES AG | Producer Manufacturing |
Empresas privadas | 1 |
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Besi Switzerland AG
![]() Besi Switzerland AG Containers/PackagingProcess Industries Part of BE Semiconductor Industries NV, Besi Switzerland AG is a Swiss company that develops assembly processes and equipment for leadframe, substrate, and wafer level packaging applications in various markets, including electronics, mobile internet, cloud server, computing, automotive, industrial, LED, and solar energy. The company is based in Cham, Switzerland. Besi Switzerland offers a range of products and services, including die attach, die bonding, flip chip, packaging molding, trim and form, singulation, accessories, and services. The company also provides process technology, chemistry and tooling, after-sales spares and tooling, customer support, and career opportunities. | Process Industries |
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