Bao Zeng Wang
Director/Miembro de la Junta en Henghui Technology Corp. Ltd. .
Cargos activos de Bao Zeng Wang
| Empresas | Cargo | Inicio | Fin |
|---|---|---|---|
Henghui Technology Corp. Ltd.
 Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Director/Miembro de la Junta | 01/11/2020 | - |
Historial de carrera de Bao Zeng Wang
Formación de Bao Zeng Wang.
| Southeast University | Graduate Degree |
Estadísticas
Internacional
| China | 3 |
Operativa
| Director/Board Member | 1 |
| Graduate Degree | 1 |
Sectorial
| Producer Manufacturing | 2 |
| Consumer Services | 2 |
Funciones ocupadas
Activas
Inactivas
Empresas cotizadas
Empresas privadas
Empresas relacionadas
| Empresas privadas | 1 |
|---|---|
Henghui Technology Corp. Ltd.
Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Producer Manufacturing |
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