Bing Feng Hu
Director Técnico/Científico/I+D en CIMS Suzhou Co., Ltd. .
Cargos activos de Bing Feng Hu
| Empresas | Cargo | Inicio | Fin |
|---|---|---|---|
CIMS Suzhou Co., Ltd.
 CIMS Suzhou Co., Ltd. Electronic ComponentsElectronic Technology CIMS Suzhou Co., Ltd. provides automated optical inspection solutions dedicated to enhancing production processes and yield in printed circuit board (PCB), high density interconnect PCB (HDI PCB), flex and rigid-flex PCB and IC substrates. The company offers automated optical inspection, automated visual/final inspection (AVI/AFI), smart factory solution, high density interconnect PCB, IC substrate, multi-layer PCB, flex PCB and special applications. CIMS Suzhou was founded in 2005 and is headquartered in Suzhou, China. | Director Técnico/Científico/I+D | 01/01/2014 | - |
Historial de carrera de Bing Feng Hu
Formación de Bing Feng Hu.
| École Nationale Supérieure d'Ingénieurs de Caen | Graduate Degree |
Estadísticas
Internacional
| China | 2 |
| Francia | 2 |
Operativa
| Chief Tech/Sci/R&D Officer | 1 |
| Graduate Degree | 1 |
Sectorial
| Electronic Technology | 2 |
| Consumer Services | 2 |
Funciones ocupadas
Activas
Inactivas
Empresas cotizadas
Empresas privadas
Empresas relacionadas
| Empresas privadas | 1 |
|---|---|
CIMS Suzhou Co., Ltd.
CIMS Suzhou Co., Ltd. Electronic ComponentsElectronic Technology CIMS Suzhou Co., Ltd. provides automated optical inspection solutions dedicated to enhancing production processes and yield in printed circuit board (PCB), high density interconnect PCB (HDI PCB), flex and rigid-flex PCB and IC substrates. The company offers automated optical inspection, automated visual/final inspection (AVI/AFI), smart factory solution, high density interconnect PCB, IC substrate, multi-layer PCB, flex PCB and special applications. CIMS Suzhou was founded in 2005 and is headquartered in Suzhou, China. | Electronic Technology |
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