Dean Personne
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Origen de la red de primer grado Dean Personne.
| Entidad | Tipo de entidad | Industria | |
|---|---|---|---|
UTAC Hong Kong Ltd.
 UTAC Hong Kong Ltd. SemiconductorsElectronic Technology Part of UTAC Holdings Ltd., UTAC Hong Kong Ltd. is a company that provides semiconductor package design, assembly, and test services. The company is based in Hong Kong, Hong Kong. UTAC Hong Kong was acquired by United Test & Assembly Center Ltd. from ASAT Holdings Ltd. on February 05, 2010 for $44.64 million.
2
| Subsidiary | Semiconductors | 2 |
Novus Packaging Corp.
 Novus Packaging Corp. Miscellaneous ManufacturingProducer Manufacturing Novus Packaging Corp provides air cushion packaging systems. The company was founded by Nocholas DeLuca and is headquartered in Richmond, CA.
1
| Subsidiary | Miscellaneous Manufacturing | 1 |
Gráfico Empresas conectadas de segundo grado
Relaciones con varias empresas
Empresas conectadas a Dean Personne a través de su red personal
| Empresa | Sector | Personas relacionadas | Puesto principal |
|---|---|---|---|
| ENERGY RECOVERY, INC. | Industrial Machinery | Corporate Officer/Principal | |
| QPL INTERNATIONAL HOLDINGS LIMITED | Semiconductors | Director/Board Member | |
| University of California, Berkeley | College/University | Undergraduate Degree | |
| University of Birmingham | College/University | Undergraduate Degree | |
| Loughborough University | College/University | Undergraduate Degree | |
| QPL Ltd. | Corporate Officer/Principal | ||
| Whitney Research | Corporate Officer/Principal | ||
| UTAC Dongguan Ltd. | Corporate Officer/Principal | ||
UBoT Holding Ltd.
 UBoT Holding Ltd. SemiconductorsElectronic Technology UBoT Holding Ltd. is a holding company, which engages in the manufacture of engineering plastics. It operates through the Back-End Semiconductor Transport Media and MEMS and Sensor Packaging Solutions segments. The Back-End Semiconductor Transport Media segment refers to the manufacturing and sale of back-end semiconductor transport media products, including JEDEC tray, carrier tape and other accessories. The MEMS and Sensor Packaging Solutions segment includes manufacturing and sale of MEMS and sensor products packages. The company was founded on February 7, 2022 and is headquartered in Hong Kong. | Semiconductors | Chief Tech/Sci/R&D Officer | |
| UBOTIC Co. Ltd. | Chief Tech/Sci/R&D Officer |
Estadísticas
Internacional
| Hong-Kong | 5 |
| Estados Unidos | 4 |
| Reino Unido | 3 |
| China | 2 |
Sectorial
| Consumer Services | 4 |
| Electronic Technology | 3 |
| Producer Manufacturing | 2 |
Operativa
| Corporate Officer/Principal | 7 |
| Undergraduate Degree | 3 |
| Chief Tech/Sci/R&D Officer | 2 |
| Director/Board Member | 1 |
| Sales & Marketing | 1 |
Las relaciones más conectadas
| Insiders | |
|---|---|
| Kin Pui Kwan | 6 |
| Terrill Sandlin | 4 |
| Hoi Ping Phen | 3 |
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