Kao Hsun Chang
President en KING YUAN ELECTRONICS CO., LTD. .
Fortuna: 10 M $ al 31/03/2024
Perfil
Kao Hsun Chang is currently the Chairman at KYEC Japan KK, Director at KYEC USA Corp., Director at KYEC Singapore Pte Ltd., Director at Zhen Kun Technology Co., Ltd., Director at Suzhou Zhen Kun Technology Ltd., General Manager at King Yuan Electronics Co., Ltd.
(starting in 2000), and Member-Supervisory Board at Jinglong Technology (Suzhou) Co. Ltd.
Mr. Chang previously worked as a Manager at Winbond Electronics Corp.
Mr. Chang holds an MBA from Saginaw Valley State University (Michigan) and an undergraduate degree from National Cheng Kung University.
Participaciones conocidas en empresas públicas
| Empresa | Fecha | Número de acciones | Valoración | Fecha de valoración |
|---|---|---|---|---|
| 31/01/2024 | 3 051 294 ( 0.25% ) | 10 M $ | 31/03/2024 |
Cargos activos de Kao Hsun Chang
| Empresas | Cargo | Inicio |
|---|---|---|
| KING YUAN ELECTRONICS CO., LTD. | President | 01/09/2023 |
| KYEC USA Corp. | Director/Board Member | - |
| KYEC Singapore Pte Ltd. | Director/Board Member | - |
| KYEC Japan KK | Chairman | - |
Jinglong Technology (Suzhou) Co. Ltd.
 Jinglong Technology (Suzhou) Co. Ltd. SemiconductorsElectronic Technology Jinglong Technology (Suzhou) Co. Ltd. engages in the research and development, design, manufacturing, packaging, testing, processing, and repair of semiconductor integrated circuits. It specializes in semiconductor IC, transistors, electronic components, electronic materials, analog or hybrid automatic data processors, solid-state memory systems, heating ovens and related products and parts. The company was founded on September 30, 2002 and is headquartered in Suzhou, China. | Director/Board Member | - |
| Zhen Kun Technology Co., Ltd. | Director/Board Member | - |
Suzhou Zhen Kun Technology Ltd.
 Suzhou Zhen Kun Technology Ltd. Electronic ComponentsElectronic Technology Suzhou Zhen Kun Technology Ltd. provides packaging services for integrated circuit products. It engages in the processing and provision of semiconductor packaging for small outline packages (SOP), thin small outline packages (TSOP), complementary metal-oxide semiconductor sensors, quad flat no-lead packages, land grid arrays, single inline packages, ball grid arrays, and memory cards. The company was founded on December 8, 2005 and is headquartered in Suzhou, China. | Director/Board Member | - |
Antiguos cargos conocidos de Kao Hsun Chang.
| Empresas | Cargo | Fin |
|---|---|---|
| WINBOND ELECTRONICS CORPORATION | Corporate Officer/Principal | - |
Formación de Kao Hsun Chang.
| Saginaw Valley State University (Michigan) | Masters Business Admin |
| National Cheng Kung University | Undergraduate Degree |
Experiencias
Funciones ocupadas
Activas
Inactivas
Empresas cotizadas
Empresas privadas
Relaciones
Relaciones de 1er grado
Empresas vinculadas al 1er grado
Hombre
Mujer
Administradores
Ejecutivos
Empresas relacionadas
| Empresas cotizadas | 2 |
|---|---|
| WINBOND ELECTRONICS CORPORATION | Electronic Technology |
| KING YUAN ELECTRONICS CO., LTD. | Commercial Services |
| Empresas privadas | 6 |
|---|---|
| KYEC USA Corp. | |
Jinglong Technology (Suzhou) Co. Ltd.
Jinglong Technology (Suzhou) Co. Ltd. SemiconductorsElectronic Technology Jinglong Technology (Suzhou) Co. Ltd. engages in the research and development, design, manufacturing, packaging, testing, processing, and repair of semiconductor integrated circuits. It specializes in semiconductor IC, transistors, electronic components, electronic materials, analog or hybrid automatic data processors, solid-state memory systems, heating ovens and related products and parts. The company was founded on September 30, 2002 and is headquartered in Suzhou, China. | Electronic Technology |
| KYEC Japan KK | |
| KYEC Singapore Pte Ltd. | |
| Zhen Kun Technology Co., Ltd. | |
Suzhou Zhen Kun Technology Ltd.
Suzhou Zhen Kun Technology Ltd. Electronic ComponentsElectronic Technology Suzhou Zhen Kun Technology Ltd. provides packaging services for integrated circuit products. It engages in the processing and provision of semiconductor packaging for small outline packages (SOP), thin small outline packages (TSOP), complementary metal-oxide semiconductor sensors, quad flat no-lead packages, land grid arrays, single inline packages, ball grid arrays, and memory cards. The company was founded on December 8, 2005 and is headquartered in Suzhou, China. | Electronic Technology |
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