Klaus Muendle

Evatec AG operates thin film powerhouse. It offers a range of platform architectures equipped with evaporation, sputter, etch and PECVD source technologies according to application, substrate format and throughput requirements. The firm offers complete process solutions in its core markets including advanced packaging, power devices, MEMS, optoelectronics, wireless technologies and photonics. The company was founded in 2004 and is headquartered in Trubbach, Switzerland.

Evatec AG operates thin film powerhouse. It offers a range of platform architectures equipped with evaporation, sputter, etch and PECVD source technologies according to application, substrate format and throughput requirements. The firm offers complete process solutions in its core markets including advanced packaging, power devices, MEMS, optoelectronics, wireless technologies and photonics. The company was founded in 2004 and is headquartered in Trubbach, Switzerland.

Evatec AG operates thin film powerhouse. It offers a range of platform architectures equipped with evaporation, sputter, etch and PECVD source technologies according to application, substrate format and throughput requirements. The firm offers complete process solutions in its core markets including advanced packaging, power devices, MEMS, optoelectronics, wireless technologies and photonics. The company was founded in 2004 and is headquartered in Trubbach, Switzerland.

Evatec AG operates thin film powerhouse. It offers a range of platform architectures equipped with evaporation, sputter, etch and PECVD source technologies according to application, substrate format and throughput requirements. The firm offers complete process solutions in its core markets including advanced packaging, power devices, MEMS, optoelectronics, wireless technologies and photonics. The company was founded in 2004 and is headquartered in Trubbach, Switzerland.

Evatec AG operates thin film powerhouse. It offers a range of platform architectures equipped with evaporation, sputter, etch and PECVD source technologies according to application, substrate format and throughput requirements. The firm offers complete process solutions in its core markets including advanced packaging, power devices, MEMS, optoelectronics, wireless technologies and photonics. The company was founded in 2004 and is headquartered in Trubbach, Switzerland.