Ling Man Pan
Director/Miembro de la Junta en Shenzhen Cau Technology Co. Ltd. /Shenzhen/ .
Cargos activos de Ling Man Pan
| Empresas | Cargo | Inicio | Fin |
|---|---|---|---|
| Shenzhen Cau Technology Co. Ltd. /Shenzhen/ | Director/Miembro de la Junta | 01/02/2011 | - |
| Independent Dir/Board Member | - | - |
Historial de carrera de Ling Man Pan
Antiguos cargos conocidos de Ling Man Pan.
| Empresas | Cargo | Inicio | Fin |
|---|---|---|---|
| SHENZHEN WOTE ADVANCED MATERIALS CO.,LTD | Director/Miembro de la Junta | 15/05/2018 | 09/04/2021 |
| Independent Dir/Board Member | 15/05/2018 | 09/04/2021 | |
| SHENZHEN SALUBRIS PHARMACEUTICALS CO., LTD. | Director/Miembro de la Junta | - | - |
| SHENZHEN DANBOND TECHNOLOGY CO.,LTD. | Director/Miembro de la Junta | - | - |
| Independent Dir/Board Member | - | - | |
| SHENZHEN COSHIP ELECTRONICS CO., LTD. | Director/Miembro de la Junta | 20/11/2009 | - |
| Independent Dir/Board Member | 20/11/2009 | - |
Formación de Ling Man Pan.
| Renmin University of China | Masters Business Admin |
| Wuhan Finance School | Undergraduate Degree |
Estadísticas
Internacional
| China | 8 |
Operativa
| Director/Board Member | 5 |
| Independent Dir/Board Member | 4 |
| Masters Business Admin | 1 |
Sectorial
| Electronic Technology | 3 |
| Consumer Services | 3 |
| Health Technology | 2 |
Funciones ocupadas
Activas
Inactivas
Empresas cotizadas
Empresas privadas
Empresas relacionadas
| Empresas cotizadas | 3 |
|---|---|
| SHENZHEN COSHIP ELECTRONICS CO., LTD. | Electronic Technology |
| SHENZHEN SALUBRIS PHARMACEUTICALS CO., LTD. | Health Technology |
| SHENZHEN WOTE ADVANCED MATERIALS CO.,LTD | Process Industries |
| Empresas privadas | 2 |
|---|---|
| Shenzhen Cau Technology Co. Ltd. /Shenzhen/ | |
Shenzhen Danbond Technology Co., Ltd.
 Shenzhen Danbond Technology Co., Ltd. Electronic ComponentsElectronic Technology Shenzhen Danbond Technology Co., Ltd. engages in the research, development, production, and sale of flexible circuits and related materials. Its products include flexible printed circuits (FPC), chip-on-flex (COF) flexible packaging substrates, and COF products. The company was founded by Ping Liu on November 20, 2001 and is headquartered in Shenzhen, China. | Electronic Technology |
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