Hsiu-Ying Chiu
Corporate Officer/Principal en SHIN FOONG SPECIALTY AND APPLIED MATERIALS CO., LTD. .
Cargos activos de Hsiu-Ying Chiu
Empresas | Cargo | Inicio | Fin |
---|---|---|---|
SHIN FOONG SPECIALTY AND APPLIED MATERIALS CO., LTD. | Corporate Officer/Principal | 22/09/2022 | - |
Presidente | 25/07/2015 | 22/09/2022 |
Historial de carrera de Hsiu-Ying Chiu
Antiguos cargos conocidos de Hsiu-Ying Chiu.
Empresas | Cargo | Inicio | Fin |
---|---|---|---|
TAIGEN BIOPHARMACEUTICALS HOLDINGS LIMITED | Director/Miembro de la Junta | 29/04/2013 | 17/12/2018 |
CHUNG HWA PULP CORPORATION | Director/Miembro de la Junta | 08/09/2010 | - |
BOARDTEK ELECTRONICS CORP | Director/Miembro de la Junta | 08/09/2010 | - |
YFY INC. | Director/Miembro de la Junta | 23/06/2006 | - |
Presidente | 23/06/2006 | - | |
Director Financiero/CFO | 23/06/2006 | - |
Formación de Hsiu-Ying Chiu.
University of Pittsburgh | Doctorate Degree |
Carnegie Mellon University | Doctorate Degree |
National Taiwan University | Doctorate Degree |
Estadísticas
Internacional
Taiwán | 7 |
Estados Unidos | 3 |
Operativa
Director/Board Member | 4 |
Doctorate Degree | 3 |
Chairman | 2 |
Sectorial
Process Industries | 4 |
Consumer Services | 4 |
Electronic Technology | 2 |
Funciones ocupadas
Activas
Inactivas
Empresas cotizadas
Empresas privadas
Empresas relacionadas
Empresas cotizadas | 4 |
---|---|
YFY INC. | Process Industries |
CHUNG HWA PULP CORPORATION | Process Industries |
TAIGEN BIOPHARMACEUTICALS HOLDINGS LIMITED | Health Technology |
SHIN FOONG SPECIALTY AND APPLIED MATERIALS CO., LTD. | Process Industries |
Empresas privadas | 1 |
---|---|
BoardTek Electronics Corp.
BoardTek Electronics Corp. Electronic ComponentsElectronic Technology BoardTek Electronics Corp. engages in the design, manufacture, and sale of multilayer PCB, single & double-sided PCB, and electronic components. Its products include PCB products, integrated circuit (IC) substrate, and green process and system integration. The PCB products cover high speed digital PCB, high frequency microwave PCB, pre-bond metal PCB, post-bonding metal PCB, coin insertion and embedding, ceramic substrate embedded PCB, and heavy copper PCB. The IC substrate covers flash and memory card substrate, complementary metal-oxide semiconductor (CMOS) image sensor substrate, and light-emitting diode (LED) Substrate. The green process and system integration covers high purity copper oxide, copper concentration control system, and insoluble anode. BoardTek Electronics was founded on June 8, 1987 and is headquartered in Taoyuan, Taiwan. | Electronic Technology |
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