Joseph M. Zachman
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Mr. Joseph M.
Zachman is Chief Operating Officer at i3 Electronics, Inc.
Mr. Zachman was previously employed as Chief Operating Officer & Senior Vice President by Wabash National Corp., Vice President & General Manager by TTM Technologies, Inc., President by CDR Corp., and Operations Director by Sanmina Corp.
He received his undergraduate degree from Purdue University and a graduate degree from Kettering University.
Antiguos cargos conocidos de Joseph M. Zachman.
| Empresas | Cargo | Fin |
|---|---|---|
| WABASH NATIONAL CORPORATION | Chief Operating Officer | 01/12/2009 |
| TTM TECHNOLOGIES, INC. | Corporate Officer/Principal | 01/12/2004 |
| CDR Corp. | President | 01/12/2002 |
| Sanmina Corp. /Old/ | Chief Operating Officer | 01/09/2001 |
i3 Electronics, Inc.
 i3 Electronics, Inc. Electronic Production EquipmentElectronic Technology i3 Electronics, Inc. engages in the design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board assembly and integrated circuits assembly and test, systems integration, cable and harness manufacturing, and failure analysis laboratories. The firm offers PCB fabrication, heterogeneous MCM, die extraction and reassembly, electronic manufacturing services, cable and harness, and other related services. The company was founded in 2002 and is headquartered in Endicott, NY. | Chief Operating Officer | - |
Formación de Joseph M. Zachman.
| Kettering University | Graduate Degree |
| Purdue University | Undergraduate Degree |
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Empresas relacionadas
| Empresas cotizadas | 2 |
|---|---|
| WABASH NATIONAL CORPORATION | Producer Manufacturing |
| TTM TECHNOLOGIES, INC. | Electronic Technology |
| Empresas privadas | 3 |
|---|---|
| Sanmina Corp. /Old/ | Electronic Technology |
i3 Electronics, Inc.
i3 Electronics, Inc. Electronic Production EquipmentElectronic Technology i3 Electronics, Inc. engages in the design and fabrication of printed circuit boards and advanced semiconductor packaging, full turnkey services for printed circuit board assembly and integrated circuits assembly and test, systems integration, cable and harness manufacturing, and failure analysis laboratories. The firm offers PCB fabrication, heterogeneous MCM, die extraction and reassembly, electronic manufacturing services, cable and harness, and other related services. The company was founded in 2002 and is headquartered in Endicott, NY. | Electronic Technology |
| CDR Corp. |
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