Cargos activos de Lewis Hwan
| Empresas | Cargo | Inicio | Fin |
|---|---|---|---|
Mutual-Pak Technology Co., Ltd.
 Mutual-Pak Technology Co., Ltd. Electronic Production EquipmentElectronic Technology Mutual-Pak Technology Co., Ltd. provides RFID design and manufactures wafer level RFID CSP, Strap, Inlay, and varied Tags. Its core technology includes Wafer Level Packaging P-CSP, P-CSP™ R/W test system and SMD for RFID assembly. The company was founded on March 26, 2006 and is headquartered in Taoyuan, Taiwan. | Presidente | 01/09/2010 | - |
| Presidente | - | - |
Historial de carrera de Lewis Hwan
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| Taiwán | 2 |
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| Chairman | 1 |
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| Electronic Technology | 2 |
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| Empresas privadas | 1 |
|---|---|
Mutual-Pak Technology Co., Ltd.
Mutual-Pak Technology Co., Ltd. Electronic Production EquipmentElectronic Technology Mutual-Pak Technology Co., Ltd. provides RFID design and manufactures wafer level RFID CSP, Strap, Inlay, and varied Tags. Its core technology includes Wafer Level Packaging P-CSP, P-CSP™ R/W test system and SMD for RFID assembly. The company was founded on March 26, 2006 and is headquartered in Taoyuan, Taiwan. | Electronic Technology |
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