Sandro Pampel
Director Ejecutivo en First Sensor Microelectronic Packaging GmbH .
Perfil
Sandro Pampel is currently a Co-Chief Executive Officer at First Sensor Microelectronic Packaging GmbH.
Cargos activos de Sandro Pampel
| Empresas | Cargo | Inicio |
|---|---|---|
First Sensor Microelectronic Packaging GmbH
 First Sensor Microelectronic Packaging GmbH Industrial SpecialtiesProcess Industries Part of TE Connectivity Ltd., First Sensor Microelectronic Packaging GmbH develops and produces customer-specific microelectronic packaging and module solutions. The company is based in Dresden, Germany. First Sensor Microelectronic Packaging was acquired by First Sensor AG from Zentrum Mikroelektronik Dresden AG on September 19, 2005. The CEOs of the German company are Matthias Peschke, Sandro Pampel. | Director Ejecutivo | - |
Experiencias
Funciones ocupadas
Activas
Inactivas
Empresas cotizadas
Empresas privadas
Relaciones
Relaciones de 1er grado
Empresas vinculadas al 1er grado
Hombre
Mujer
Administradores
Ejecutivos
Empresas relacionadas
| Empresas privadas | 1 |
|---|---|
First Sensor Microelectronic Packaging GmbH
First Sensor Microelectronic Packaging GmbH Industrial SpecialtiesProcess Industries Part of TE Connectivity Ltd., First Sensor Microelectronic Packaging GmbH develops and produces customer-specific microelectronic packaging and module solutions. The company is based in Dresden, Germany. First Sensor Microelectronic Packaging was acquired by First Sensor AG from Zentrum Mikroelektronik Dresden AG on September 19, 2005. The CEOs of the German company are Matthias Peschke, Sandro Pampel. | Process Industries |
- Bolsa de valores
- Insiders
- Sandro Pampel
