William Crockett

Corporate Officer/Principal en Microbonds, Inc. .

Electronic Technology

Consumer Services

Government

Cargos activos de William Crockett

Empresas	Cargo	Inicio	Fin
Microbonds, Inc. Microbonds, Inc. SemiconductorsElectronic Technology Microbonds, Inc. develops microchip interconnect solutions. It engages in the research and development and application of gold and copper insulated bonding wire technology for the semiconductor packaging and microchip industries. The company was founded by John I. Persic and Robert Lyn in 1999 and is headquartered in Markham, Canada.	Corporate Officer/Principal	01/01/2005	-

Empresas	Cargo	Inicio	Fin
Statschippac Ltd. Statschippac Ltd. SemiconductorsElectronic Technology Statschippac Ltd. provides semiconductor packaging design, assembly, testing, and distribution solutions. The private company is based in Fremont, CA.	Corporate Officer/Principal	-	-
US Department of the Navy (District of Columbia)	Corporate Officer/Principal	-	-

California Polytechnic State University (San Luis Obispo)

Undergraduate Degree

Internacional

Estados Unidos	4
Canadá	2

Operativa

Corporate Officer/Principal	3
Undergraduate Degree	1

Sectorial

Funciones ocupadas

Activas

Inactivas

Empresas cotizadas

Empresas privadas

Empresas privadas	3
Microbonds, Inc. Microbonds, Inc. SemiconductorsElectronic Technology Microbonds, Inc. develops microchip interconnect solutions. It engages in the research and development and application of gold and copper insulated bonding wire technology for the semiconductor packaging and microchip industries. The company was founded by John I. Persic and Robert Lyn in 1999 and is headquartered in Markham, Canada.	Electronic Technology
US Department of the Navy (District of Columbia)	Government
Statschippac Ltd. Statschippac Ltd. SemiconductorsElectronic Technology Statschippac Ltd. provides semiconductor packaging design, assembly, testing, and distribution solutions. The private company is based in Fremont, CA.	Electronic Technology