![Sheng Jen Wu](data:image/svg+xml,<svg xmlns="http://www.w3.org/2000/svg" width="16" height="16" fill="%231b1b1b" class="bi bi-person-fill" viewBox="0 0 16 16"><path d="M3 14s-1 0-1-1 1-4 6-4 6 3 6 4-1 1-1 1zm5-6a3 3 0 1 0 0-6 3 3 0 0 0 0 6"/></svg>)
Fortuna: 3 M $ al 30/09/2026
Sheng Jen Wu has been Senior Vice President-Manufacturing Center at Chipbond Technology Corp.
since 2011.
Mr. Wu graduated from National Tsing-Hua University.
| Empresa | Fecha | Número de acciones | Valoración | Fecha de valoración |
|---|---|---|---|---|
| 31/01/2026 | 507.757 ( 0,07 % ) | 3 M $ | 30/09/2026 |
| Empresas | Cargo | Inicio |
|---|---|---|
| CHIPBOND TECHNOLOGY CORPORATION | Corporate Officer/Principal | 01/01/2011 |
Activas
Inactivas
Empresas cotizadas
Empresas privadas
Relaciones de 1er grado
Empresas vinculadas al 1er grado
Hombre
Mujer
Administradores
Ejecutivos
| Empresas privadas | 2 |
|---|---|
Chipbond Technology Corp.
 Chipbond Technology Corp. SemiconductorsElectronic Technology Manufactures and distributes wafer bumps, chips, and other electronic components | Electronic Technology |
National Tsing-Hua University
 National Tsing-Hua University Other Consumer ServicesConsumer Services Functions as a College/University | Consumer Services |
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