![Hong Feng Liu](data:image/svg+xml,<svg xmlns="http://www.w3.org/2000/svg" width="16" height="16" fill="%231b1b1b" class="bi bi-person-fill" viewBox="0 0 16 16"><path d="M3 14s-1 0-1-1 1-4 6-4 6 3 6 4-1 1-1 1zm5-6a3 3 0 1 0 0-6 3 3 0 0 0 0 6"/></svg>)
Hong Feng Liu
Director/Miembro de la Junta en
Beijing Nissin Electronics Precision Component Co. Ltd.
.
Perfil
Hong Feng Liu is currently a Director at Beijing Nissin Electronics Precision Component Co. Ltd. Formerly, the role was Board Secretary & Vice President at BOE Technology Group Co., Ltd. from 2016 to 2025.
Education includes graduate studies at Beihang University.
Cargos activos de Hong Feng Liu
| Empresas | Cargo | Inicio |
|---|---|---|
Beijing Nissin Electronics Precision Component Co. Ltd.
 Beijing Nissin Electronics Precision Component Co. Ltd. Miscellaneous ManufacturingProducer Manufacturing Manufactures metal stampings | Director/Miembro de la Junta | - |
Antiguos cargos conocidos de Hong Feng Liu.
| Empresas | Cargo | Fin |
|---|---|---|
| BOE TECHNOLOGY GROUP COMPANY LIMITED | Public Communications Contact | 14/01/2025 |
Formación de Hong Feng Liu.
Experiencias
Funciones ocupadas
Activas
Inactivas
Empresas cotizadas
Empresas privadas
Relaciones
1
Relaciones de 1er grado
3
Empresas vinculadas al 1er grado
Hombre
Mujer
Administradores
Ejecutivos
Empresas relacionadas
| Empresas privadas | 3 |
|---|---|
BOE Technology Group Co., Ltd.
 BOE Technology Group Co., Ltd. Electronic Equipment/InstrumentsElectronic Technology Supplies semiconductor display technologies, products and services | Electronic Technology |
Beihang University
 Beihang University Other Consumer ServicesConsumer Services Functions as a College/University | Consumer Services |
Beijing Nissin Electronics Precision Component Co. Ltd.
Beijing Nissin Electronics Precision Component Co. Ltd. Miscellaneous ManufacturingProducer Manufacturing Manufactures metal stampings | Producer Manufacturing |
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- Hong Feng Liu
