Hong Feng Liu
Public Communications Contact en BOE TECHNOLOGY GROUP COMPANY LIMITED .
Fortuna: 853 579 $ al 31/03/2024
Perfil
Hong Feng Liu is currently the Director at Beijing Nissin Electronics Precision Component Co. Ltd.
and the Board Secretary & Vice President at BOE Technology Group Co., Ltd.
Prior to his current positions, he graduated from Beihang University.
Participaciones conocidas en empresas públicas
| Empresa | Fecha | Número de acciones | Valoración | Fecha de valoración |
|---|---|---|---|---|
| 30/06/2023 | 1 024 500 ( 0.00% ) | 575 513 $ | 31/03/2024 | |
| 30/06/2023 | 495 000 ( 0.16% ) | 278 066 $ | 31/03/2024 |
Cargos activos de Hong Feng Liu
| Empresas | Cargo | Inicio |
|---|---|---|
| BOE TECHNOLOGY GROUP COMPANY LIMITED | Public Communications Contact | - |
Beijing Nissin Electronics Precision Component Co. Ltd.
 Beijing Nissin Electronics Precision Component Co. Ltd. Miscellaneous ManufacturingProducer Manufacturing Beijing Nissin Electronics Precision Component Co. Ltd. is a private company that manufactures metal stampings. The company is based in Beijing, China. | Director/Board Member | - |
Formación de Hong Feng Liu.
| Beihang University | Graduate Degree |
Experiencias
Funciones ocupadas
Activas
Inactivas
Empresas cotizadas
Empresas privadas
Relaciones
Relaciones de 1er grado
Empresas vinculadas al 1er grado
Hombre
Mujer
Administradores
Ejecutivos
Empresas relacionadas
| Empresas cotizadas | 1 |
|---|---|
| BOE TECHNOLOGY GROUP COMPANY LIMITED | Electronic Technology |
| Empresas privadas | 1 |
|---|---|
Beijing Nissin Electronics Precision Component Co. Ltd.
Beijing Nissin Electronics Precision Component Co. Ltd. Miscellaneous ManufacturingProducer Manufacturing Beijing Nissin Electronics Precision Component Co. Ltd. is a private company that manufactures metal stampings. The company is based in Beijing, China. | Producer Manufacturing |
- Bolsa de valores
- Insiders
- Hong Feng Liu
