Toshiyuki Yamagishi
Director/Miembro de la Junta en CASIO COMPUTER CO., LTD. .
Cargos activos de Toshiyuki Yamagishi
| Empresas | Cargo | Inicio | Fin |
|---|---|---|---|
| CASIO COMPUTER CO., LTD. | Director/Miembro de la Junta | 01/06/2013 | - |
| Corporate Officer/Principal | 01/06/2020 | - | |
| Director Administrativo | 01/04/2009 | 01/12/2010 | |
| Public Communications Contact | 01/10/2019 | 01/06/2020 | |
Casio Micronics Co., Ltd.
 Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry. | Corporate Officer/Principal | 26/03/2012 | - |
| Director/Miembro de la Junta | 11/10/2011 | 26/03/2012 | |
| Independent Dir/Board Member | 11/10/2011 | 26/03/2012 |
Historial de carrera de Toshiyuki Yamagishi
Estadísticas
Internacional
| Japón | 3 |
Operativa
| Director/Board Member | 2 |
| Corporate Officer/Principal | 2 |
| Independent Dir/Board Member | 1 |
Sectorial
| Electronic Technology | 2 |
| Consumer Durables | 2 |
Funciones ocupadas
Activas
Inactivas
Empresas cotizadas
Empresas privadas
Empresas relacionadas
| Empresas cotizadas | 1 |
|---|---|
| CASIO COMPUTER CO., LTD. | Consumer Durables |
| Empresas privadas | 1 |
|---|---|
Casio Micronics Co., Ltd.
Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry. | Electronic Technology |
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