Toshiyuki Yamagishi

Director/Board Member en CASIO COMPUTER CO., LTD. .

63 años

Consumer Durables

Electronic Technology

Perfil

Toshiyuki Yamagishi currently works at Casio Computer Co., Ltd., as Director, Executive Officer & Head-ESG Strategy from 2020 and Casio Micronics Co., Ltd., as Executive Officer & Senior Manager-Business from 2012.

Cargos activos de Toshiyuki Yamagishi

Empresas	Cargo	Inicio
CASIO COMPUTER CO., LTD.	Director/Board Member	01/06/2013
Casio Micronics Co., Ltd. Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry.	Corporate Officer/Principal	26/03/2012

Todos los cargos activos de Toshiyuki Yamagishi

Experiencias
Funciones ocupadas

Activas

Inactivas

Empresas cotizadas

Empresas privadas

Ver el detalle de la experiencia de Toshiyuki Yamagishi.

Relaciones

Relaciones de 1er grado

Empresas vinculadas al 1er grado

Hombre

Mujer

Administradores

Ejecutivos

Consultar la red personal

Empresas relacionadas

Empresas cotizadas	1
CASIO COMPUTER CO., LTD.	Consumer Durables

Empresas privadas	1
Casio Micronics Co., Ltd. Casio Micronics Co., Ltd. SemiconductorsElectronic Technology Since its founding in 1987, Casio Micronics has been engaged in the development of wafer bump forming technology and the provision of wafer bumping services. Casio Micronics is committed along with its partners and collaborating companies to assisting customers in the areas of related testing, dicing, tape & reel, device control, substrate embedding, modularization, design and other technologies and business areas. Furthermore, for the protection of the global environment, Casio Micronics also aims to contribute to the development of embedded wafer level package (EWLP) technology, in order to realize solderless mounting, which is an energy conservation theme in the mounting industry.	Electronic Technology